1932

Abstract

High-/metal gate technology is on the verge of replacing conventional oxynitride dielectrics in state-of-the-art transistors for both high-performance and low-power applications. In this review we discuss some of the key materials issues that complicated the introduction of high- dielectrics, including reduced electron mobility, oxygen-based thermal instabilities, and the absence of thermally stable dual-metal electrodes. We show that through a combination of materials innovations and engineering ingenuity these issues were successfully overcome, thereby paving the way for high-/metal gate implementation.

Loading

Article metrics loading...

/content/journals/10.1146/annurev-matsci-082908-145320
2009-08-04
2024-04-27
Loading full text...

Full text loading...

/content/journals/10.1146/annurev-matsci-082908-145320
Loading
/content/journals/10.1146/annurev-matsci-082908-145320
Loading

Data & Media loading...

  • Article Type: Review Article
This is a required field
Please enter a valid email address
Approval was a Success
Invalid data
An Error Occurred
Approval was partially successful, following selected items could not be processed due to error