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Annual Review of Materials Research

Volume 38, 2008

Review Article

Wetting in Soldering and Microelectronics

T. Matsumoto¹, and K. Nogi¹
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Affiliations: Joining and Welding Research Institute, Osaka University, Osaka 567-0047, Japan; email: [email protected], [email protected]
Vol. 38:251-273 (Volume publication date August 2008) https://doi.org/10.1146/annurev.matsci.38.060407.132448
© Annual Reviews

Abstract

Wettability of solid metals by molten solders is reviewed. The contact angle and wetting force are tabulated for various combinations of solid metals and molten solders such as Sn-Pb base alloys, Sn-Ag base alloys, Sn-Zn base alloys, Sn-Cu base alloys, and Sn-Bi base alloys. Studies on the wetting rate are also discussed.

Keyword(s): contact angle, sessile drop method, wetting balance method, wetting force

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2008-08-04

2024-05-08

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Wetting in Soldering and Microelectronics

Annual Review of Materials Research 38, 251 (2008); https://doi.org/10.1146/annurev.matsci.38.060407.132448

/content/journals/10.1146/annurev.matsci.38.060407.132448

/content/journals/10.1146/annurev.matsci.38.060407.132448

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