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Annual Review of Materials Research

Volume 26,

Review Article

Stress-Induced Voiding in Microelectronic Metallization: Void Growth Models and Refinements

Timothy D. Sullivan¹
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Affiliations: Reliability Engineering, IBM Microelectronics, 1000 River Road, Essex Junction, Vermont 05452
Vol. 26:333-364 (Volume publication date August 1996) https://doi.org/10.1146/annurev.ms.26.080196.002001
© Annual Reviews

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1996-08-01

2024-12-06

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Article Type: Review Article

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